Amkor S-SWIFT™ Technology Breakdown

Substrate-SWIFT (S-SWIFT™) technology, also known as Silicon Wafer Integrated Fan-Out (on Substrate), is revolutionizing the world of advanced packaging. By boosting I/O and circuit density while shrinking the footprint and profile, S-SWIFT is the go-to solution for both single-die and multi-die applications, perfectly aligning with the escalating demand for higher IC integration in mobile and networking devices. Learn more at https://amkor.com/s-swift/