Chip Scale Power Transistor Packaging

Power packaging technologies are split between discrete and integrated solutions, using a wide variety of form factors and sizes. Applications in power management, delivery, conversion and switching are all ripe for innovation. Recent advancements in packaging allow for size reduction with enhanced electrical performance and integration. This presentation will explore power packaging. technologies in use today and introduce Amkor’s new PowerCSP™ chip scale package family for both discrete and integrated power.

Presented by Shaun Bowers, VP, Wirebond & Power Package Development at Amkor Technology

Originally presented at IMAPS Device Packaging Conference, April 12-15, 2021. Visit Devicepackaging.org for details about next year’s Conference.